• When remote teaching and mobile office become the trend, cloud operators continue to use data centers as the main growth driver for servers.
• In the demand of high-speed upload and download of AI, IOT, 5G, etc., server chip manufacturers continue to improve their performance in database, file transmission, application servers and other products. At this time, high-efficiency thermal management become an important issue.
• Server product architecture designs are different according to thermal module design. However, no matter air-cooling or water-cooling design, thermal interface material is playing significant role.
• LiPOLY thermal interface material with high thermal conductivity and low thermal resistance can effectively improve the performance of high-power chips. Combined with air cooling, water cooling module design can effectively achieve energy saving and increase computing efficiency.
