About Shiu Li

Event Timeline

  • Mar 2021
  • Jun 2020
  • Frb 2019
  • Apr 2018
  • Feb 2018
  • Jul 2017
  • Jul 2017
  • Apr 2017
  • Apr 2017
  • Apr 2017
  • Mar 2017
  • Jan 2017
  • Aug 2017
  • May 2017
  • May 2017
  • Aug 2017
  • Jan 2017
  • Feb 2016
  • Oct 2016
  • Sep 2016
  • Aug 2016
  • Aug 2016
  • Sep 2015
  • Jun 2014
  • Jul 2013
  • May 2012
  • Oct 2011
  • Oct 2010
  • Apr 2010
  • Jul 2009
  • Jul 2009
  • Jul 2009
  • Jan 2008
  • May 2007
  •   Obtained a patent for a plug-in thermal conductive elastomer.
  •   Successfully mass-produced ultra-high thermal conductivity PUTTY.
  •   Successfully mass-produced a non-silicon, two-component fixing glue.
  •   Obtained a patent for a multilayer composite thermal conduction structure.
  •   Successfully mass-produced ultra-high thermal conductivity pads.
  •   Obtained a patent for a radiator with circuits applied by screen printing or spray painting.
  •   Participated in the Guangzhou International Lighting Exhibition.
  •   Attended the Japan Advanced Technology Exhibition in Chiba, Japan.
  •   Exhibited at the 89th China Electronics Fair in Shanghai.
  •   Participated in the Optical Communications Technology Exhibition in Tokyo, Japan.
  •   Exhibited at the Munich Shanghai Electronics Show in Shanghai, China.
  •   Participated in Car-ele Japan in Tokyo, Japan.
  •   Obtained a patent for a radiator with screen-printed or spray-painted circuits.
  •   Obtained a patent for a radiator with circuits applied by screen printing or spray painting.
  •   Obtained a patent for a multilayer composite thermal conduction structure.
  •   Obtained a patent for a multilayer composite heat conduction structure.
  •   Obtained a patent for a hardened thermal conductive interface material and its heat dissipation device.
  •   Awarded the Dun & Bradstreet Corporation Certification.
  •   Obtained a patent for a cured thermal conductive interface sheet and its heat dissipation device.
  •   Obtained a patent for a cured thermal conductive interface component and its heat dissipation device.
  •   Obtained a patent for a high-viscosity colloidal coating machine.
  •   Obtained a patent for a high-viscosity gel coating machine.
  •   Successfully mass-produced low oil-bleeding thermal pads.
  •   Obtained a patent for a glue film feeding mechanism.
  •   Successfully mass-produced a non-silicone thermal conductive liquid gel.
  •   Successfully mass-produced a 5G millimeter wave thermal series.
  •   Successfully mass-produced a thermal absorbing wave series.
  •   Obtained a patent for a heat dissipation plate structure with a cooling film.
  •   Successfully mass-produced silicone-type thermal conductive liquid gel.
  •   Obtained a patent for an electrical circuit composite heat dissipation body.
  •   Obtained a patent for an electrical circuit composite heat dissipation body.
  •   Obtained a patent for an electric circuit composite heat dissipation body.
  •   Obtained a patent for a multi-layer composite material that conducts heat and absorbs electromagnetic waves, and its manufacturing method.
  •   Obtained a patent for a multilayer composite thermal conduction structure.