• Customers require product applications be designed delicate and fast transit efficiency. The limited characteristics of silicon crystal materials have reached their limits in high-power and high-frequency applications. Therefore, 3rd generation semiconductor Gallium Nitride (GaN) become focus of Industry. The main characteristics of the 3RD generation semiconductor Sic and GaN are high frequency, high power, and high voltage.
•Due to its small size, but high frequency, high power, high voltage and other characteristics of the components, engineers are actively pursuing for ultra-low thermal resistance, high thermal conductivity, and high reliability interface materials to improve performance, reduce external Environmental impact & mechanical stress, increase service life for cost reduction.
• Shiu Li Technology actually participated into the design project developed by the customer, successfully solved the heat transfer problem of the high-power chip with high-reliability materials, and passed the application test of the GaN module of the international customers.
